No-clean type flux HB-L15F 1 piece

Product DescriptionNo-clean type flux. Product Features Excellent solderability reduces solder bridges and unsoldered areas. The flux residue is non-corrosive and highly reliable, making it suitable for no-clean applications. Low solid content, less stickiness, and easy to handle. To improve work efficiency during soldering work To improve solderability of repaired parts Protects the copper foil surface of homemade circuit boards before soldering Main ingredient: rosin Passed copper plate corrosion test Insulation resistance (humid): 1 x 1010 Ω or more Migration test no abnormalities Chlorine content: 0.03% NET15ml