It has good thermal conductivity and is therefore a material with excellent heat dissipation properties.
It has a linear expansion coefficient close to that of silicon, so it is used as a component for semiconductor devices. Size (mm): 50 x 50 x 5t
Thermal conductivity: 184W/(m・K)
Linear expansion coefficient (at 350℃): 4.6×10^-6/℃
Surface roughness: Ra1.6
Parallelism: 10μm
RoHS2 (EU)2015/863 compliant [About RoHS]
