1-liquid type room temperature curing type hardening heat dissipation silicone SCV-22 1 piece

This is a one-component, room temperature curing, hardening paste-like silicone with high thermal conductivity. Simply apply between the CPU and heatsink to improve thermal conductivity and secure it in place. It has moderate viscosity and is easy to work with. Heat dissipation for semiconductor devices such as power transistors, ICs, and CPUs. Filling between transistors, rectifiers, thyristors, etc. and heat sinks. Color: White Capacity (g): 20 Specific gravity: 2.26 Volume resistivity (Ω・cm): 1.0×10^15 Operating temperature range: -40 to 150°C Viscosity (paste): 85 to 108 Pa・s Thermal conductivity: 0.92W/m・k Material/Finish: Methyltrimethoxysilane, Aluminum Oxide, Silica Country of Origin: Japan Code number: 327-5329