AIKA Neda Floor and Bundle Solvent-Free JW-400K-760ml JW400K760ML 1 Bottle

Catalog number: JW400K760ML Features: ● Solvent-free urethane resin adhesive. ● Not only can it be used to bond Neda Floors, but also steel and plastic bundles. ● Because it is solvent-free, it can also be used to bond polystyrene foam. ● It is also compatible with underfloor heating. ● JIS F☆☆☆☆ standard product. ● Compliant with the JAIA 4VOC standard of the Japan Adhesives Industry Association. Applications: ● Adhesion of Neda Floors. ● Underfloor heating. ● Adhesion of steel and plastic bundles. ● Adhesion of polystyrene foam, etc. Specifications: ● Color: White ● Capacity (ml): 760 ● Operating temperature range (℃): 5 to 35 ● Pot life (min): Summer: within 15, Winter: within 30 ● Viscosity (mPa・s): 70000 ● JIS standard: JIS A 5536・5550 F☆☆☆☆ ● Cartridge type Material/Finish: ● Main component: Urethane resin