Storage case for precision parts Gel-Pak (3mm square 10 x 10 squares) GR-AD-22C-00-X0-P (10X10) 1 piece

Non-adhesive chip/wafer carrier case made of special polymer material Gel-Pak chip and wafer carriers are non-adhesive carrier cases. They are made of a special polymer material and are treated to maintain a consistent gel surface smoothness. When a part is placed in the gel, friction and interfacial forces with the part's surface hold it in place on the carrier case. The AD series is a box type with gel applied directly to the bottom of the carrier case. It can be used for transporting, carrying and storing large substrates, modules, packaged devices, etc. We recommend using the AD series for chip components that are handled with tweezers. Features: Capable of holding semiconductor chips ranging from small to large sizes, and can store chips and wafers of different sizes, and parts of different shapes, in the same carrier. Prevents damage to stored items caused by static electricity generated by vibrations during transport. To prevent static electricity, you can use a conductive case (black) or tray (black) with a surface resistance of 10^5Ω/□ or less. The colorless and transparent cases and trays are insulating types with a surface resistance of 100MΩ/□ or more. The gel's surface resistance is also insulating type with a surface resistance of 100MΩ/□ or more. After production, the gel does not change over time at room temperature, so there is no difference in elongation rate or other properties with normal use over time. Gases generated by gels are controlled according to standard ASTMF-1227. For details, please refer to the Gel-Pack catalogue. specification series AD: Apply gel directly to the bottom of the carrier case Case dimensions (mm) 53 x 53 x 10t (2 inches) Case type T: Transparent case (non-static) Gel retention X0: Standard Print 10 x 10 squares, approx. 3mm square Storage chip size Small size (0.8mm/□ or less) Tweezers used: Regular tweezers Heat-resistant gel: -55℃ to +200℃ Case: +65℃ Tray: +65℃