Ultra-high thermal conductivity heat dissipation sheet Non-adhesive type Conductive STT-M50α-BA 1 sheet

It is used by sandwiching it between a heat generating body (such as a CPU) and a heat dissipating body (such as a heat sink). This heat dissipation sheet utilizes the high thermal conductivity of carbon fiber through a unique magnetic field orientation technology, while maintaining the flexibility and adhesiveness of polymers. Type: Non-adhesive type Thermal conductivity: 50W/m・K Size: 45 x 45 x 0.5mm Hardness (JIS Type E): 50 Volume resistance value: <500 Ω cm Dielectric breakdown voltage (AC): <0.1 AC kV/mm Operating temperature range: -40 to +150°C Flame retardant (UL 94): V-0 Base polymer: Silicone