Because it is a very soft material, it can cover the entire contact surface even in places where the mounting surface such as a board is uneven, efficiently absorbing heat from each heat-generating component and the entire board, and transferring the heat to the heat sink or heat sink.
High flexibility: Adheres to uneven surfaces and quickly conducts heat from the heating element to the heat sink.
High thermal conductivity: High thermal conductivity is achieved by uniformly dispersing special fillers.
High insulation: The insulated type boasts high insulation of 10 to 15. CTI=600 level.
Highly compressible: It can be compressed to less than half its thickness, significantly reducing thermal resistance.
Waterproof and dustproof: Due to the properties of silicone resin, it exhibits high levels of waterproof and dustproof properties.
Vibration resistance: Maintains high flexibility under a wide range of temperature conditions. Protects electronic devices from vibration. Thermal conductivity: 4.0W/m・K
Size: 40mm x 40mm x 12mm thick
Hardness: Asker C5 or less
Operating temperature range: -40℃ to 200℃
Glass transition temperature: -40℃
Surface resistance: 15E or more Ω cm
Specific gravity: 3.0g/cm3
Insulation
RoHS2.0 compliant (as of May 2020)
