Because it is a very soft material, it can cover the entire contact surface even in places where the mounting surface such as a board is uneven, efficiently absorbing heat from each heat-generating component and the entire board, and transferring the heat to the heat sink or heat sink.
High flexibility: Adheres to uneven surfaces and quickly conducts heat from the heating element to the heat sink.
High thermal conductivity: High thermal conductivity is achieved by uniformly dispersing and blending special fillers.
High insulation: The insulated type boasts high insulation of 10 to 15. CTI=600 level.
Highly compressible: Can be compressed to less than half its thickness, significantly reducing thermal resistance.
Waterproof and dustproof...Due to the properties of silicone resin, it exhibits high levels of waterproof and dustproof properties.
Vibration resistance: Maintains high flexibility under a wide range of temperature conditions. Protects electronic devices from vibration. Thermal conductivity: 4.0W/m・K
Size: 80mm x 80mm x 5mm thick
Hardness: Asker C 5 or less
Operating temperature range: -40℃ to 200℃
Glass transition temperature: -40℃
Surface resistance: 15E or more Ω cm
Specific gravity: 3.0g/cm3
Insulation
RoHS2.0 compliant (as of March 2020)
