ENGINEER Solder Bar Superior RMA No-Clean Solder 0.8mm SWS-08 1 piece

Catalog number: SWS-08 Features: ●Since the flux residue is completely non-corrosive, cleaning of the board after soldering is not necessary. ●The activity lasts for a long time, and the excellent spreading rate and solder wettability allow for quicker work. ●The residue is non-hygroscopic and has excellent electrical insulation. ●The activity lasts for a long time, and it exhibits excellent wettability. ●Uses organic amine-based special activated rosin (non-chlorine type). ●Complies with JIS-AA class and MIL-RMA standards. Applications: ●For copper and copper alloy precision boards. Specifications: ●Wire diameter (mm): 0.8 ●Length (m): 4.4 ●Shape: Round bar ●Melting point: 183-190°C ●Flux: JIS-AA class Material/Finish: ●Alloy composition (tin: 60%, lead: 40%)