2-inch silicon wafer for research use [P(100), 1-100Ω] Single-sided mirror DF product 25 pieces per box (25 pieces per box)

We have a proven track record in research and development, and can supply wafers made of high-purity materials in small quantities. Size: 2-inch silicon wafer Diameter (mm): 50.0±0.2 Wafer thickness (μm): 280±25 Manufacturing method: CZ method Conduction type: P type Surface orientation: 100 OF direction: 110 Resistance value (Ω cm): 1 to 100 OF: Yes Surface condition: Mirror/etched Particles: Dust Free TTV(μm):≦25 Quantity: 25 pieces (1 box) *Special order available This allows for highly precise processing with smaller tolerances for orientation (cutting angle), OF orientation angle, and thickness, enabling accurate groove formation by etching. A wide variety of shape processing and surface treatments are possible (e.g., countersinking, drilling, and oxide-coated wafers). We can accommodate your desired resistivity and wafer thickness. *This product is manufactured using crystal materials for semiconductors, but we are not able to provide certification regarding the purity of the materials. 1st orientation flat, 2nd orientation flat not included