Excellent heat resistance and rigidity, making it suitable for storing wafers after high-temperature processing. Capacity: 25 pieces
Material: Bishop 3 (highly conductive resin)
Suitable wafer size: 8 inches
The material "Bishop 3" is a product name of Dainichi Shoji Co., Ltd., and is made by kneading carbon into PEI (polyetherimide) resin.
